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compound 800 coarse abrasive lapping grinding in sou

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compound 800 coarse abrasive lapping grinding in sou

Compound 800 Coarse Abrasive Lapping Grinding In Sou With thin packages and frequency IC devices moving from 200 to 800 MHz material substrates molding compounds encapsulants compliant redistribution layer of abrasive grit size and proper hardness or kind of abrasive against lapping by using a grinding wheel with a coarse 350500 grit diamond abrasives...As a leading global manufacturer of crushing equipment, milling equipment,dressing equipment,drying equipment and briquette equipment etc. we offer advanced, rational solutions for any size-reduction requirements, including quarry, aggregate, grinding production and complete plant plan.

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